Invention Grant
- Patent Title: Headphone assembly
- Patent Title (中): 耳机装配
-
Application No.: US13736800Application Date: 2013-01-08
-
Publication No.: US09025806B2Publication Date: 2015-05-05
- Inventor: Charles Krissman , Michael Craig Krisztal
- Applicant: The Ketchum Group, Inc.
- Assignee: The Ketchum Group
- Current Assignee: The Ketchum Group
- Agency: Tsircou Law, P.C.
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10

Abstract:
A headphone assembly is provided that includes two earpieces coupled by a flexible connecting wire. Each earpiece includes a single large button disposed on a distal side of the earpiece, thereby enabling a wearer to operate the system, even without direct access thereto.
Public/Granted literature
- US20140193020A1 HEADPHONE ASSEMBLY Public/Granted day:2014-07-10
Information query