Invention Grant
- Patent Title: Heat dissipation module adapted to an electronic device and electronic device therewith
- Patent Title (中): 散热模块适用于电子设备及其电子设备
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Application No.: US13727572Application Date: 2012-12-26
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Publication No.: US09025328B2Publication Date: 2015-05-05
- Inventor: Meng-Ting Chiang , Yao-Lung Tsai , Wei-Hsing Wang , Chieu-Tu Cheng
- Applicant: Wistron Corporation
- Applicant Address: TW Hsichih, New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW Hsichih, New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: TW101205400U 20120326
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; G06F1/16 ; H05K7/20 ; G06F1/20 ; F28D15/02 ; F28D21/00

Abstract:
A heat dissipation module includes a fan and a thermal fin portion. The fan includes a fan body, a plurality of blade units and a plurality of blade extensions. The blade units are connected to the fan body. The blade extensions protrude from the blade units, respectively. A first surface is formed on a side of each of the blade extensions. A distance between the first surface and an axis of the fan body is increasing along an inflow direction. The thermal fin portion includes a plurality of fin units and a plurality of fin extensions respectively protruding from the fin units. A second surface is formed on a side facing the fan extension of each of the fin extension. An identical gap is formed between at least one portion of the first surface and at least one portion of the second surface.
Public/Granted literature
- US20130250518A1 HEAT DISSIPATION MODULE ADAPTED TO AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREWITH Public/Granted day:2013-09-26
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