Invention Grant
US09025079B2 Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus 有权
紧凑型低照度固态成像装置和包括紧凑型低照度固态成像装置的电子系统

  • Patent Title: Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus
  • Patent Title (中): 紧凑型低照度固态成像装置和包括紧凑型低照度固态成像装置的电子系统
  • Application No.: US13422915
    Application Date: 2012-03-16
  • Publication No.: US09025079B2
    Publication Date: 2015-05-05
  • Inventor: Yasuhiro Kamada
  • Applicant: Yasuhiro Kamada
  • Applicant Address: JP
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP
  • Agency: Sheridan Ross P.C.
  • Priority: JP2011-085328 20110407
  • Main IPC: H04N5/225
  • IPC: H04N5/225 H01L27/146
Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus
Abstract:
A solid-state imaging apparatus includes: a solid-state imaging device mounted on a substrate; a bonding wire that electrically connects a pad formed on the solid-state imaging device to a lead island formed on the substrate; a frame member that has a frame-like shape and surrounds side portions of the solid-state imaging device; and a light-transmissive optical member so accommodated in the frame member that the optical member faces an imaging surface of the solid-state imaging device, wherein the frame member has a leg portion extending from the side where the optical member is present toward the imaging surface, and the frame member is integrally fixed to the solid-state imaging device with an end of the bonding wire that is connected to the pad covered with the leg portion.
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