Invention Grant
- Patent Title: Bending vibration piece, method for manufacturing the same and electronic device
- Patent Title (中): 弯曲振动片,其制造方法和电子装置
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Application No.: US13533511Application Date: 2012-06-26
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Publication No.: US09024508B2Publication Date: 2015-05-05
- Inventor: Masashi Shimura , Takayuki Kikuchi
- Applicant: Masashi Shimura , Takayuki Kikuchi
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-141480 20110627
- Main IPC: H03H9/21
- IPC: H03H9/21 ; H01L41/09 ; H03H3/02

Abstract:
A double-side tuning fork-type bending vibration piece having a basal part, a pair of drive vibration arms, a pair of detection vibration arms, drive electrodes and detection electrodes includes adjustment films of a metallic material or the like formed in connecting areas between the vibration arms and the basal part. The adjustment films are formed in such a way as to cover an area of tapered portions formed in connecting parts between the drive vibration arms and the basal part, an area of the basal part near the tapered portions and an area of the drive vibration arms. While monitoring a detection current outputted from the detection electrodes when the drive vibration arms are excited in driving mode, the adjustment films are partly deleted by laser irradiation so that the detection current becomes 0.
Public/Granted literature
- US20120326571A1 BENDING VIBRATION PIECE, METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC DEVICE Public/Granted day:2012-12-27
Information query
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