Invention Grant
- Patent Title: Semiconductor device and method for forming the same
- Patent Title (中): 半导体装置及其形成方法
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Application No.: US14165379Application Date: 2014-01-27
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Publication No.: US09024409B2Publication Date: 2015-05-05
- Inventor: Tae O Jung
- Applicant: SK Hynix Inc.
- Applicant Address: KR Icheon
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Icheon
- Priority: KR10-2011-0039692 20110427
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/76 ; H01L21/761 ; H01L29/06 ; H01L27/108 ; H01L29/423

Abstract:
A semiconductor device and a method for forming the same are disclosed. In a method for forming the semiconductor substrate including a cell region and a peripheral region, a guard pattern defined by an epitaxial growth layer located at the edge part between the cell region and the peripheral region is formed. As the guard pattern is not damaged by an oxidation process, a bias leakage path between an N-well bias and a P-well bias of the peripheral region is prevented from occurring Reliability of a gate oxide film may be increased, resulting in an increased production yield of the semiconductor device and implementation of stable voltage and current characteristics.
Public/Granted literature
- US20140141593A1 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME Public/Granted day:2014-05-22
Information query
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