Invention Grant
- Patent Title: Systems, devices, and methods for delivering an implant
- Patent Title (中): 用于输送植入物的系统，装置和方法
-
Application No.: US11906967Application Date: 2007-10-03
-
Publication No.: US09022918B2Publication Date: 2015-05-05
- Inventor: Michael S. H. Chu
- Applicant: Michael S. H. Chu
- Applicant Address: US MN Maple Grove
- Assignee: Boston Scientific Scimed, Inc.
- Current Assignee: Boston Scientific Scimed, Inc.
- Current Assignee Address: US MN Maple Grove
- Main IPC: A61F2/02
- IPC: A61F2/02 ; A61F2/00 ; A61B17/062 ; A61B17/04 ; A61B17/28 ; A61B17/00 ; A61B17/29
Abstract:
The present disclosure provides systems, methods, devices, and kits for delivering an implant to an anatomical site in a patient. In some instances, a delivery device for delivering an implant includes a receiver with a through-lumen and a transfer pin for associating with the implant and the lumen. In some embodiments, a method for delivering an implant to an anatomical site in a patient comprises transferring the implant or a portion thereof from one section of a delivery device to another.
Public/Granted literature
- US20080082121A1 Systems, devices, and methods for delivering an implant Public/Granted day:2008-04-03
Information query
IPC分类:
