Invention Grant
- Patent Title: Semiconductor light emitting device comprising cut-and-bent portions
- Patent Title (中): 半导体发光器件包括切割和弯曲部分
-
Application No.: US14328638Application Date: 2014-07-10
-
Publication No.: US09022613B2Publication Date: 2015-05-05
- Inventor: Satoshi Komatsubara , Kenichi Fukuda , Shinobu Otao , Toru Furuta
- Applicant: Shimane Prefectural Government , Shimane Electronic Imafuku Works Co., Ltd.
- Applicant Address: JP Matsue-shi JP Hamada-shi
- Assignee: Shimane Prefectural Government,Shimane Electronic Imafuku Works Co., Ltd.
- Current Assignee: Shimane Prefectural Government,Shimane Electronic Imafuku Works Co., Ltd.
- Current Assignee Address: JP Matsue-shi JP Hamada-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2008-081716 20080326
- Main IPC: F21V29/00
- IPC: F21V29/00 ; H01L33/64 ; H01L25/075 ; H01L33/60 ; H05K1/02 ; H01L33/48 ; H01L33/62 ; F21K99/00 ; F21Y101/02 ; F21Y105/00
Abstract:
Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).
Public/Granted literature
- US20140319552A1 SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-10-30
Information query
