Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US14300009Application Date: 2014-06-09
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Publication No.: US09022529B2Publication Date: 2015-05-05
- Inventor: Hitoshi Takaai , Yuma Fukuzawa , Yoichi Naganuma
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agent Workman Nydegger
- Priority: JP2013-121579 20130610; JP2013-151380 20130722; JP2014-014085 20140129
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14

Abstract:
A liquid ejecting head includes a pressure chamber substrate formed of silicon where a pressure chamber is formed, and a communication plate penetrated by communication holes in a plate thickness direction, in which the pressure chamber partitioned by partition walls formed of crystal orientation planes being formed in the recording head through etching. Acute angle portions are formed, by the partition walls intersecting with each other at an acute angle, in both end portions of the pressure chamber in a first direction, and a first step is disposed in the middle of each of the acute angle portions in an etching direction. Parts of the communication holes are arranged at positions superimposed on the acute angle portions in a bonding surface and remaining parts of the communication holes are arranged on outer sides in the first direction with respect to the acute angle portions such that a second step is formed in a communication portion between the pressure chamber and the communication holes.
Public/Granted literature
- US20140362142A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2014-12-11
Information query
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