Invention Grant
US09022045B2 Substrate liquid cleaning apparatus with controlled liquid port ejection angle
有权
具有受控液体端口喷射角度的底物液体清洗装置
- Patent Title: Substrate liquid cleaning apparatus with controlled liquid port ejection angle
- Patent Title (中): 具有受控液体端口喷射角度的底物液体清洗装置
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Application No.: US13337547Application Date: 2011-12-27
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Publication No.: US09022045B2Publication Date: 2015-05-05
- Inventor: Jiro Higashijima , Nobuhiro Ogata , Satoshi Kaneko , Shuichi Nagamine , Yoshihiro Kai
- Applicant: Jiro Higashijima , Nobuhiro Ogata , Satoshi Kaneko , Shuichi Nagamine , Yoshihiro Kai
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2010-293793 20101228; JP2011-240333 20111101
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687

Abstract:
Disclosed is a liquid treatment apparatus including a nozzle positioned below the substrate retained by a substrate retaining unit. The nozzle is capable of ejecting two fluids of a mixture of a liquid and a gas. The nozzle includes a plurality of liquid-ejecting passages for ejecting a liquid and a plurality of gas-ejecting passages for ejecting a gas, and also includes a plurality of liquid-ejecting ports each corresponding to one of the liquid-ejecting passages. The liquid-ejecting ports are arrayed on a horizontal line extending inwardly from a position below a peripheral portion of the substrate. The liquid-ejecting ports are configured to eject the liquid towards the lower surface of the substrate in an ejecting direction, and the ejecting direction is inclined at an inclination angle in a rotating direction of the substrate rotated by rotational driving unit with respect to a plane including the lower surface of the substrate.
Public/Granted literature
- US20120160275A1 LIQUID TREATMENT APPARATUS AND METHOD Public/Granted day:2012-06-28
Information query
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