Invention Grant
- Patent Title: Pressure sensor chip
- Patent Title (中): 压力传感器芯片
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Application No.: US13800609Application Date: 2013-03-13
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Publication No.: US09021885B2Publication Date: 2015-05-05
- Inventor: Yuuki Seto , Tomohisa Tokuda
- Applicant: Azbil Corporation
- Applicant Address: JP Tokyo
- Assignee: Azbil Corporation
- Current Assignee: Azbil Corporation
- Current Assignee Address: JP Tokyo
- Agency: Troutman Sanders LLP
- Priority: JP2012-057205 20120314
- Main IPC: G01L13/02
- IPC: G01L13/02 ; G01L9/06 ; G01L13/06 ; G01L9/00

Abstract:
A pressure sensor chip includes a sensor diaphragm that outputs a signal in accordance with a pressure differential, and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith. In the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm.
Public/Granted literature
- US20130239694A1 PRESSURE SENSOR CHIP Public/Granted day:2013-09-19
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