Invention Grant
- Patent Title: Method for manufacturing surface acoustic wave apparatus
- Patent Title (中): 声表面波装置的制造方法
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Application No.: US12376546Application Date: 2007-08-07
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Publication No.: US09021669B2Publication Date: 2015-05-05
- Inventor: Toru Fukano
- Applicant: Toru Fukano
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Procopio, Cory, Hargreaves & Savitch LLP.
- Priority: JP2006-214162 20060807
- International Application: PCT/JP2007/065435 WO 20070807
- International Announcement: WO2008/018452 WO 20080214
- Main IPC: H03H9/15
- IPC: H03H9/15 ; H03H3/08 ; H03H9/05 ; H03H9/145 ; H01L41/23 ; H01L41/27 ; H03H9/10 ; H05K1/14 ; H05K3/34

Abstract:
Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.
Public/Granted literature
- US20100043189A1 Method for Manufacturing Surface Acoustic Wave Apparatus Public/Granted day:2010-02-25
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