Invention Grant
- Patent Title: Integrated circuit system providing enhanced communications between integrated circuit dies and related methods
- Patent Title (中): 集成电路系统提供集成电路管芯之间的增强通信和相关方法
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Application No.: US13560414Application Date: 2012-07-27
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Publication No.: US08990540B2Publication Date: 2015-03-24
- Inventor: Andrew Michael Jones , Stuart Ryan
- Applicant: Andrew Michael Jones , Stuart Ryan
- Applicant Address: GB Marlow Bucks
- Assignee: STMicroelectronics (Research & Development) Limited
- Current Assignee: STMicroelectronics (Research & Development) Limited
- Current Assignee Address: GB Marlow Bucks
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: GB1112981.4 20110728
- Main IPC: G06F12/10
- IPC: G06F12/10 ; G06F13/16

Abstract:
A method may include receiving, at a first integrated circuit die, a memory transaction having an address from a second integrated circuit die. The method may further include determining, at the first integrated circuit die and based on the address, if the transaction is for the first integrated circuit die and, if so, translating the address. If transaction is for a third integrated circuit die, the transaction may be transmitted, without modification to the address, to the third integrated circuit die. The translation may be based upon a first table with each entry including a first address and a second translated address corresponding to the first address, and a second table with each entry including a first address and an indication if the transaction is to be forwarded without modification to the address.
Public/Granted literature
- US20130031330A1 ARRANGEMENT AND METHOD Public/Granted day:2013-01-31
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