Invention Grant
- Patent Title: Optical-electrical wiring board and optical module
- Patent Title (中): 光电接线板和光模块
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Application No.: US13259460Application Date: 2010-03-30
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Publication No.: US08989531B2Publication Date: 2015-03-24
- Inventor: Maraki Maetani , Masahiko Hirose
- Applicant: Maraki Maetani , Masahiko Hirose
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2009-083740 20090330
- International Application: PCT/JP2010/055744 WO 20100330
- International Announcement: WO2010/113968 WO 20101007
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/43 ; H01S5/022 ; H01S5/183 ; H05K1/02 ; H05K3/46

Abstract:
The invention relates to an optical-electrical wiring board (2) and an optical module (1). The optical-electrical wiring board (2) includes a substrate (8), a dielectric layer (11), first conductive layers (16a) and second conductive layers (16b). The dielectric layer (11) includes a first region (B) and a second region (C). The first region (B) constitutes a plurality of light transmission portions (11B). The second region (C) has a plurality of pairs of conductive layers each having an overlap portion (10) in which one of the plurality of second conductive layers (16b) and one of the plurality of first conductive layers (16a) overlap each other when seen through in a laminated direction (a) of the dielectric layer (11) and the substrate (8).
Public/Granted literature
- US20120014641A1 OPTICAL-ELECTRICAL WIRING BOARD AND OPTICAL MODULE Public/Granted day:2012-01-19
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