Invention Grant
- Patent Title: Earphones
- Patent Title (中): 耳机
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Application No.: US13911662Application Date: 2013-06-06
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Publication No.: US08989427B2Publication Date: 2015-03-24
- Inventor: Ryan C. Silvestri , Jason Harlow , Kevin P. Annunziato
- Applicant: Bose Corporation
- Applicant Address: US MA Framingham
- Assignee: Bose Corporation
- Current Assignee: Bose Corporation
- Current Assignee Address: US MA Framingham
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R1/28

Abstract:
An earphone includes a first acoustic chamber with one or more of a reactive element and a resistive element for acoustically coupling the first acoustic chamber with an environment external to the earphone. The earphone includes an acoustic transducer and a second acoustic chamber separated from the first acoustic chamber by the acoustic transducer. A housing supports the earphone from the concha of a wearer's ear and extends the second acoustic chamber at least to an entrance of an ear canal of the wearer's ear. A port acoustically couples the first and second acoustic chambers.
Public/Granted literature
- US20140363040A1 Earphones Public/Granted day:2014-12-11
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