Invention Grant
- Patent Title: Relay dualization apparatus
- Patent Title (中): 继电器二元化装置
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Application No.: US13550408Application Date: 2012-07-16
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Publication No.: US08988980B2Publication Date: 2015-03-24
- Inventor: Kyung Ho Kim
- Applicant: Kyung Ho Kim
- Applicant Address: KR Anyang-Si, Gyeonggi-Do
- Assignee: LSIS Co., Ltd.
- Current Assignee: LSIS Co., Ltd.
- Current Assignee Address: KR Anyang-Si, Gyeonggi-Do
- Agency: Lee, Hong, Degerman, Kang & Waimey
- Priority: KR10-2011-0085748 20110826
- Main IPC: H04L29/14
- IPC: H04L29/14

Abstract:
Provided is a relay dualization apparatus, in a substation automation system including at least one or more upper units and at least one or more lower units, the apparatus including a plurality of first relays receiving a power data from the lower unit using a predetermined communication method, and transmitting the power data to the upper unit, and receiving a control command from the upper unit and transmitting the control command to the lower unit, and a second relay performing communications with the plurality of first relays using the communication method to replace a relay that has generated an error in the plurality of relays.
Public/Granted literature
- US20130051215A1 RELAY DUALIZATION APPARATUS Public/Granted day:2013-02-28
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