Invention Grant
- Patent Title: Component mounting structures with breakaway support tabs
- Patent Title (中): 具有分离支撑片的组件安装结构
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Application No.: US13598308Application Date: 2012-08-29
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Publication No.: US08988890B2Publication Date: 2015-03-24
- Inventor: Michael B. Wittenberg , Jared M. Kole , Sawyer I. Cohen , Shayan Malek
- Applicant: Michael B. Wittenberg , Jared M. Kole , Sawyer I. Cohen , Shayan Malek
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group
- Agent Kendall P. Woodruff
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.
Public/Granted literature
- US20140063769A1 Component Mounting Structures with Breakaway Support Tabs Public/Granted day:2014-03-06
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