Invention Grant
- Patent Title: Asymmetric chip-to-chip interconnect
- Patent Title (中): 不对称的芯片到芯片互连
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Application No.: US13621063Application Date: 2012-09-15
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Publication No.: US08972632B2Publication Date: 2015-03-03
- Inventor: Timothy M. Hollis
- Applicant: Timothy M. Hollis
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06F3/00
- IPC: G06F3/00 ; G06F13/42
Abstract:
Methods and apparatus to transfer data between a first device and a second device, is disclosed. An apparatus according to various embodiments may comprise a first device and a second device. The first device may comprise at least one first non-differential transmitter coupled to a first channel, at least one second non-differential transmitter coupled to a second channel, and at least one differential receiver to receive a data bit and its complement on the first and second channels in parallel. The second device may comprise at least one first non-differential receiver coupled to the first channel, at least one second non-differential receiver coupled to the second channel, and at least one differential transmitter to transmit a data bit and its complement on the first and second channels in parallel.
Public/Granted literature
- US20130022137A1 ASYMMETRIC CHIP-TO-CHIP INTERCONNECT Public/Granted day:2013-01-24
Information query
