Invention Grant
- Patent Title: Phased array scanning into a curvature
- Patent Title (中): 相控阵扫描成曲率
-
Application No.: US13359262Application Date: 2012-01-26
-
Publication No.: US08972206B2Publication Date: 2015-03-03
- Inventor: Chad Martin Shaffer , Peter Renzel , Jerome Poirier , Michael Maria Berke , Douglas Paul Lutz , Rai Mohan Dasarathan , Anandamurugan S
- Applicant: Chad Martin Shaffer , Peter Renzel , Jerome Poirier , Michael Maria Berke , Douglas Paul Lutz , Rai Mohan Dasarathan , Anandamurugan S
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Main IPC: G01B5/28
- IPC: G01B5/28 ; G01N9/24

Abstract:
A system for use in determining a location of a defect in an object is provided. The system includes an ultrasonic phased array configured to provide a sector scan of the object, a display, and a processor. The processor is programmed to provide a volume-corrected view of a sector of an ultrasonic inspection of the object on the display, wherein the object has a first surface defined by a first radius and a second surface defined by a second radius that is shorter than the first radius, receive gate parameters of a gate used to measure a location of a reflection of a beam emitted from the ultrasonic phased array, wherein the reflection is indicative of a defect on the first surface or the second surface, and calculate a location of the defect using the gate.
Public/Granted literature
- US20130197822A1 PHASED ARRAY SCANNING INTO A CURVATURE Public/Granted day:2013-08-01
Information query