Invention Grant
- Patent Title: Circuit board
- Patent Title (中): 电路板
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Application No.: US14233565Application Date: 2012-07-18
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Publication No.: US08970791B2Publication Date: 2015-03-03
- Inventor: Toshikazu Yoshida , Hideaki Ozawa
- Applicant: Toshikazu Yoshida , Hideaki Ozawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sony Corporation
- Priority: JP2011-165295 20110728
- International Application: PCT/JP2012/068182 WO 20120718
- International Announcement: WO2013/015168 WO 20130131
- Main IPC: H04N5/50
- IPC: H04N5/50 ; H04B1/18 ; H04H20/71 ; H04J4/00 ; H03F3/195 ; H03H7/24 ; H03H7/48 ; H05K1/02

Abstract:
Provided a circuit board including an input terminal to which a high-frequency signal is input, a high-frequency amplifier for amplifying the high-frequency signal input to the input terminal, at least one distributor distributing the high-frequency signal, a plurality of high-frequency processing circuits of which transmission path lengths for inputting each of the high-frequency signals distributed by the distributor into signal inputting sections of the plurality of high-frequency processing circuits are different from one another, and a plurality of attenuating devices which are mounted at previous stages of each of the plurality of high-frequency processing circuits and possess amounts of attenuation which increase with decrease of the transmission path lengths.
Public/Granted literature
- US20140146240A1 CIRCUIT BOARD Public/Granted day:2014-05-29
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