Invention Grant
- Patent Title: Chip module and method for fabricating a chip module
- Patent Title (中): 芯片模块及其制造方法
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Application No.: US13239059Application Date: 2011-09-21
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Publication No.: US08970032B2Publication Date: 2015-03-03
- Inventor: Ralf Otremba , Josef Hoeglauer , Martin Standing
- Applicant: Ralf Otremba , Josef Hoeglauer , Martin Standing
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/495 ; H01L23/00 ; H01L23/31 ; H01L21/56 ; H01L23/492
Abstract:
The chip module includes a semiconductor chip having a first contact element on a first main face and a second contact element on a second main face. The semiconductor chip is arranged on a corner in such a way that the first main face of the semiconductor chip faces the carrier. One or more electrical connectors are connected to the carrier and include end faces located in a plane above a plane of the second main face of the semiconductor chip.
Public/Granted literature
- US20130069243A1 Chip Module and Method for Fabricating a Chip Module Public/Granted day:2013-03-21
Information query
IPC分类:
