Invention Grant
- Patent Title: Structure and method for FinFET device
- Patent Title (中): FinFET器件的结构和方法
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Application No.: US13523658Application Date: 2012-06-14
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Publication No.: US08969974B2Publication Date: 2015-03-03
- Inventor: Jhon Jhy Liaw
- Applicant: Jhon Jhy Liaw
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
The present disclosure provides one embodiment of a field effect transistor (FET) structure. The FET structure includes shallow trench isolation (STI) features formed in a semiconductor substrate; a plurality of semiconductor regions defined in the semiconductor substrate and isolated from each other by the STI features; and a multi-fin active region of a first semiconductor material disposed on one of the semiconductor regions of the semiconductor substrate.
Public/Granted literature
- US20130334614A1 STRUCTURE AND METHOD FOR FINFET DEVICE Public/Granted day:2013-12-19
Information query
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