Invention Grant
- Patent Title: Substrate processing apparatus and method of disassembling and assembling the same
- Patent Title (中): 基板加工装置及其拆装组装方法
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Application No.: US13244535Application Date: 2011-09-25
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Publication No.: US08968474B2Publication Date: 2015-03-03
- Inventor: Kun-Young Lim , Do-Hyung Kim , Ju-Ill Lee
- Applicant: Kun-Young Lim , Do-Hyung Kim , Ju-Ill Lee
- Applicant Address: KR
- Assignee: Jusung Engineering Co., Ltd.
- Current Assignee: Jusung Engineering Co., Ltd.
- Current Assignee Address: KR
- Priority: KR10-2010-0101357 20101018
- Main IPC: C23C16/44
- IPC: C23C16/44 ; C23F1/00 ; H01L21/306 ; H01L21/67 ; H01J37/32 ; H01L21/683 ; C23C16/06 ; C23C16/22
Abstract:
A substrate processing apparatus includes: a chamber including a body having an open portion and a door for blocking the open portion; a substrate supporter connected to the door; and a door operating means including a rotation shaft for straightly moving and rotating the door, the door and the body separated in parallel from each other by straightly moving the door.
Public/Granted literature
- US20120091871A1 SUBSTRATE PROCESSING APPARATUS AND METHOD OF DISASSEMBLING AND ASSEMBLING THE SAME Public/Granted day:2012-04-19
Information query
IPC分类:
