Invention Grant
- Patent Title: Analyzing sparse wiring areas of an integrated circuit design
- Patent Title (中): 分析集成电路设计的稀疏布线区域
-
Application No.: US13887487Application Date: 2013-05-06
-
Publication No.: US08949755B2Publication Date: 2015-02-03
- Inventor: Timothy D. Helvey
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Richard A. Wilhelm; James R. Nock
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A set of nets in an integrated circuit design, having a timing margin and traverse routing tiles, are identified. The set of nets are assigned a utilization metric based on the traversed routing tiles. A set of sparse nets are determined from the set of nets, based on the utilization metric of each net in the set of sparse nets. One or more target nets are selected from the set of sparse nets, based on the timing margin of the target nets. The target nets may be modified.
Public/Granted literature
- US20140331196A1 ANALYZING SPARSE WIRING AREAS OF AN INTEGRATED CIRCUIT DESIGN Public/Granted day:2014-11-06
Information query