Invention Grant
- Patent Title: Microphone with backplate having specially shaped through-holes
- Patent Title (中): 带背板的麦克风具有特殊形状的通孔
-
Application No.: US12939504Application Date: 2010-11-04
-
Publication No.: US08948419B2Publication Date: 2015-02-03
- Inventor: Xin Zhang
- Applicant: Xin Zhang
- Applicant Address: US CA San Jose
- Assignee: Invensense, Inc.
- Current Assignee: Invensense, Inc.
- Current Assignee Address: US CA San Jose
- Agency: IPxLaw Group LLP
- Agent Maryam Imam
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R19/04 ; H04R1/22 ; H04R7/20 ; H04R31/00 ; H04R19/00
Abstract:
A MEMS microphone has 1) a backplate with a backplate interior surface and a plurality of through-holes, and 2) a diaphragm spaced from the backplate. The diaphragm is movably coupled with the backplate to form a variable capacitor. At least two of the through-holes have an inner dimensional shape (on the backplate interior surface) with a plurality of convex portions and a plurality of concave portions.
Public/Granted literature
- US20110075866A1 Microphone with Backplate Having Specially Shaped Through-Holes Public/Granted day:2011-03-31
Information query
