Invention Grant
- Patent Title: Split laminated DC bus structure
- Patent Title (中): 分层式直流总线结构
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Application No.: US13415893Application Date: 2012-03-09
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Publication No.: US08947899B2Publication Date: 2015-02-03
- Inventor: Robert Allen Savatski , Michael Loth , Lee Gettelfinger
- Applicant: Robert Allen Savatski , Michael Loth , Lee Gettelfinger
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Fay Sharpe LLP
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
An apparatus and method for mounting additional components, such as capacitors, to a DC bus of a motor drive. In one aspect, a motor drive includes an enclosure defining an interior, an input for receiving input electrical power from a power source, an output for providing output electrical power to a load, an intermediate DC circuit including a DC bus located in the interior of the enclosure, and a modular capacitor bus electrically coupled with the intermediate DC circuit, the modular capacitor bus including at least one capacitor mounted thereto. The modular capacitor bus is mountable as a unit to the DC bus.
Public/Granted literature
- US20130234636A1 SPLIT LAMINATED DC BUS STRUCTURE Public/Granted day:2013-09-12
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