Invention Grant
- Patent Title: Substantially rigid interconnection structure for devices
- Patent Title (中): 器件的基本刚性互连结构
-
Application No.: US13716223Application Date: 2012-12-17
-
Publication No.: US08947888B2Publication Date: 2015-02-03
- Inventor: Eric C. Peterson , David T. Harper
- Applicant: Microsoft Corporation
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Agent Judy Yee; Steve Wight; Micky Minhas
- Main IPC: H01R12/50
- IPC: H01R12/50 ; H01R43/20 ; H04Q1/02

Abstract:
A substantially cable-free board connection assembly may include a plurality of printed circuit boards (PCBs) forming an interconnect plane for a plurality of electronic devices respectively attached to a plurality of plane boards included in the interconnect plane. An insertion direction for substantially all connectors is substantially perpendicular to a face of the interconnect plane. At least a portion of the board connection assembly is mounted to a support structure via a flexible connection.
Public/Granted literature
- US20140170865A1 SUBSTANTIALLY RIGID INTERCONNECTION STRUCTURE FOR DEVICES Public/Granted day:2014-06-19
Information query