Invention Grant
- Patent Title: Housing for an on-board electronic card
- Patent Title (中): 机载电子卡的房屋
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Application No.: US13264185Application Date: 2010-04-06
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Publication No.: US08947881B2Publication Date: 2015-02-03
- Inventor: Jesus Aspas Puertolas , Nicolas Maisonnave , Emile Colongo , Sylvain Bourdou
- Applicant: Jesus Aspas Puertolas , Nicolas Maisonnave , Emile Colongo , Sylvain Bourdou
- Applicant Address: FR Paris
- Assignee: European Aeronautic Defence and Space Company EADS France
- Current Assignee: European Aeronautic Defence and Space Company EADS France
- Current Assignee Address: FR Paris
- Agency: Young & Thompson
- Priority: FR0952450 20090414
- International Application: PCT/EP2010/054553 WO 20100406
- International Announcement: WO2010/118971 WO 20101021
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.
Public/Granted literature
- US20120140417A1 HOUSING FOR AN ON-BOARD ELECTRONIC CARD Public/Granted day:2012-06-07
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