Invention Grant
- Patent Title: Expansion card module
- Patent Title (中): 扩展卡模块
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Application No.: US13761163Application Date: 2013-02-07
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Publication No.: US08947862B2Publication Date: 2015-02-03
- Inventor: Pei Hua Sun
- Applicant: Giga-Byte Technology Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: Giga-Byte Technology Co., Ltd.
- Current Assignee: Giga-Byte Technology Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Chun-Ming Shih
- Priority: TW101150663A 20121227
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/18

Abstract:
An expansion card module includes a box, a tray, a circuit board, and an interconnection device. The box is disposed in a drive bay on the front of a case of a computer. The tray is movably installed in the box and has a slide mechanism. The tray slides into or out of the box by the slide mechanism. The circuit board is disposed on the tray and has a first expansion slot. An expansion card electrically inserts into the first expansion slot of the circuit board, and the circuit board is electrically connected to the motherboard of computer through the interconnection device.
Public/Granted literature
- US20140185208A1 EXPANSION CARD MODULE Public/Granted day:2014-07-03
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