Invention Grant
US08947834B2 Method and apparatus for chemical-mechanical polishing 有权
化学机械抛光方法和装置

Method and apparatus for chemical-mechanical polishing
Abstract:
In accordance with certain embodiments, a method can be utilized that includes depositing a backfill material layer over a reader stack; depositing a chemical-mechanical-polishing stop layer above the layer of backfill material; and depositing a sacrificial layer on top of the chemical-mechanical-polishing stop layer.
Public/Granted literature
Information query
Patent Agency Ranking
0/0