Invention Grant
- Patent Title: Electrically conductive laminate structure containing graphene region
- Patent Title (中): 导电层压结构
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Application No.: US12833074Application Date: 2010-07-09
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Publication No.: US08946903B2Publication Date: 2015-02-03
- Inventor: Gurtej S. Sandhu
- Applicant: Gurtej S. Sandhu
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01B13/00 ; H01L21/768 ; H01L23/532

Abstract:
Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the graphene and non-graphene regions may be nested within one another. In some embodiments an electrically insulative material may be over an upper surface of the laminate structure, and an opening may extend through the insulative material to a portion of the laminate structure. Electrically conductive material may be within the opening and in electrical contact with at least one of the non-graphene regions of the laminate structure. Some embodiments include methods of forming electrical interconnects in which non-graphene material and graphene are alternately formed within a trench to form nested non-graphene and graphene regions.
Public/Granted literature
Information query
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