Invention Grant
- Patent Title: Carbon fiber thermal interface for cooling module assembly
- Patent Title (中): 用于冷却模块组装的碳纤维热接口
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Application No.: US13327001Application Date: 2011-12-15
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Publication No.: US08945749B2Publication Date: 2015-02-03
- Inventor: Axel Heise , Alastair Gordon Anderson , Stefan Toepfer
- Applicant: Axel Heise , Alastair Gordon Anderson , Stefan Toepfer
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Fraser Clemens Martin & Miller LLC
- Agent James D. Miller
- Main IPC: H01M10/50
- IPC: H01M10/50 ; H01M10/647 ; H01M10/6551 ; H01M10/6554 ; B60K1/04
Abstract:
A cooling system includes a cooling plate configured to abut a battery cell. A heat sink is in thermal communication with the cooling plate by at least one carbon fiber brush, the carbon fiber brush coupled to one of the cooling plate and the heat sink and flexible at a free end.
Public/Granted literature
- US20130157100A1 CARBON FIBER THERMAL INTERFACE FOR COOLING MODULE ASSEMBLY Public/Granted day:2013-06-20
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