Invention Grant
- Patent Title: Stacked process modules for a semiconductor handling system
- Patent Title (中): 用于半导体处理系统的堆叠过程模块
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Application No.: US13248600Application Date: 2011-09-29
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Publication No.: US08944738B2Publication Date: 2015-02-03
- Inventor: Peter van der Meulen
- Applicant: Peter van der Meulen
- Applicant Address: US MA Chelmsford
- Assignee: Brooks Automation, Inc.
- Current Assignee: Brooks Automation, Inc.
- Current Assignee Address: US MA Chelmsford
- Agency: Perman & Green, LLP
- Agent Colin C. Durham
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; B25J9/04 ; H01L21/68 ; H01L21/687
Abstract:
Methods and systems are provided for a vacuum-based semiconductor handling system. The system may be a linear system with a four-link robotic SCARA arm for moving materials in the system. The system may include one or more vertically stacked load locks or vertically stacked process modules.
Public/Granted literature
- US20120014769A1 STACKED PROCESS MODULES FOR A SEMICONDUCTOR HANDLING SYSTEM Public/Granted day:2012-01-19
Information query
IPC分类:
