Invention Grant
- Patent Title: Breaking apparatus for glass substrate
- Patent Title (中): 玻璃基板破碎装置
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Application No.: US13541177Application Date: 2012-07-03
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Publication No.: US08944304B2Publication Date: 2015-02-03
- Inventor: Hyung-sang Roh , Ja-Yong Koo , Sung Cheal Kim , Won-Kyu Park , Chang-Ha Lee
- Applicant: Hyung-sang Roh , Ja-Yong Koo , Sung Cheal Kim , Won-Kyu Park , Chang-Ha Lee
- Applicant Address: KR Gumi-Si
- Assignee: Corning Precision Materials Co., Ltd.
- Current Assignee: Corning Precision Materials Co., Ltd.
- Current Assignee Address: KR Gumi-Si
- Agency: Stein IP, LLC
- Priority: KR10-2012-0047394 20120504
- Main IPC: C03B33/00
- IPC: C03B33/00

Abstract:
Disclosed herein is a breaking apparatus for glass substrates. The breaking apparatus includes a breaking bar connected to a linear driver, a plurality of linear bushes longitudinally mounted on the breaking bar and each including an outer barrel, a plurality of buffer cylinders longitudinally mounted on the breaking bar, and a breaking tip extending in one direction and having a bar shape with a predetermined width. Each of the buffer cylinders includes a hollow cylinder body generating pressure therein, a piston received in the cylinder body, and a piston rod connected to the piston. The breaking tip is disposed in a longitudinal direction of the breaking bar beneath the breaking bar and connected to the piston rods and the shafts to be brought into contact with a glass substrate.
Public/Granted literature
- US20130292444A1 BREAKING APPARATUS FOR GLASS SUBSTRATE Public/Granted day:2013-11-07
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