Invention Grant
US08943855B2 Methods for laser cutting articles from ion exchanged glass substrates
有权
从离子交换玻璃基板激光切割制品的方法
- Patent Title: Methods for laser cutting articles from ion exchanged glass substrates
- Patent Title (中): 从离子交换玻璃基板激光切割制品的方法
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Application No.: US13387790Application Date: 2010-08-27
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Publication No.: US08943855B2Publication Date: 2015-02-03
- Inventor: Sinue Gomez , Lisa Anne Moore , Sergio Tsuda
- Applicant: Sinue Gomez , Lisa Anne Moore , Sergio Tsuda
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent John T. Haran
- International Application: PCT/US2010/046894 WO 20100827
- International Announcement: WO2011/025908 WO 20110303
- Main IPC: C03B33/02
- IPC: C03B33/02 ; C03B33/04 ; C03B33/09

Abstract:
A method of cutting an article (172) from a chemically strengthened glass substrate (110) includes generating a pulsed laser beam (108) from a laser source (106). The pulsed laser beam (108) may have a pulse duration of less than about 1000 fs and an output wavelength such that the chemically strengthened glass substrate (110) is substantially transparent to the pulsed laser beam (108). The pulsed laser beam (108) may be focused to form a beam waist (109) that is positioned in the same horizontal plane as an inner tensile region (124) of the chemically strengthened glass substrate (110). The beam waist (109) may be translated in a first pass along a cut line (116), wherein the beam waist (109) traverses an edge (111) of the chemically strengthened glass substrate. The beam waist (113) may then be translated in a second pass along the cut line (116) such that a crack (119) propagates from the edge (113) along the cut line (116) ahead of the translated beam waist (109) during the second pass.
Public/Granted literature
- US20130180665A2 METHODS FOR LASER CUTTING ARTICLES FROM ION EXCHANGED GLASS SUBSTRATES Public/Granted day:2013-07-18
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