Invention Grant
- Patent Title: Connecting device
- Patent Title (中): 连接装置
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Application No.: US13915297Application Date: 2013-06-11
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Publication No.: US08843215B2Publication Date: 2014-09-23
- Inventor: Stefan Eck , Michael Arnold , Thomas Flierl , Peter Meidlein , Manuela Koehler , Christiane Podszuck , Erich Haas , Josef Teske
- Applicant: Biotronik SE & Co. KG
- Applicant Address: DE Berlin
- Assignee: Biotronik SE & Co. KG
- Current Assignee: Biotronik SE & Co. KG
- Current Assignee Address: DE Berlin
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: DE102012209872 20120613
- Main IPC: A61N1/00
- IPC: A61N1/00 ; A61N1/375 ; A61N1/362 ; A61N1/372
Abstract:
A connecting device for an electromedical implant having a housing, the connecting device including a feedthrough and a header. The feedthrough and the header are formed in one piece so as to reduce the cost of the production process.
Public/Granted literature
- US20130338750A1 CONNECTING DEVICE Public/Granted day:2013-12-19
Information query
