Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
- Patent Title (中): 阵列基板及其制造方法
-
Application No.: US13150376Application Date: 2011-06-01
-
Publication No.: US08842231B2Publication Date: 2014-09-23
- Inventor: Xiang Liu , Seongyeol Yoo , Jianshe Xue
- Applicant: Xiang Liu , Seongyeol Yoo , Jianshe Xue
- Applicant Address: CN Beijing
- Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
- Current Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201010197073 20100603
- Main IPC: G02F1/136
- IPC: G02F1/136 ; H01L29/786 ; H01L27/12 ; G02F1/1362
Abstract:
An array substrate comprises: a base substrate; a gate scanning line, a data scanning line, a pixel electrode and a thin film transistor, formed on the base substrate; and a light blocking layer, formed on the base substrate and corresponding to the thin film transistor and the data scanning line.
Public/Granted literature
- US20110299004A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-12-08
Information query
IPC分类:
