Invention Grant
- Patent Title: Printed wiring board including first and second insulating layers having dielectric loss tangents that are different by a predetermined relationship
- Patent Title (中): 印刷电路板包括具有不同于预定关系的介电损耗角正切的第一绝缘层和第二绝缘层
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Application No.: US13345974Application Date: 2012-01-09
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Publication No.: US08841976B2Publication Date: 2014-09-23
- Inventor: Taiji Ogawa , Hirohito Watanabe , Masazaku Sato
- Applicant: Taiji Ogawa , Hirohito Watanabe , Masazaku Sato
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-027624 20110210
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H05K1/02

Abstract:
The printed wiring board has a conductor of signal line 41 and two conductive lines 42 on one face of the first insulating layer 10 covered by a second insulating layer 20, while having a ground layer of the ground 30 potential on the opposite face thereof, when the dielectric tangent A of the second insulating layer (insulating layer A) 20 is larger than the dielectric tangent B of the first insulating layer (insulating layer B) 10, Relational Expression 1: (relative permittivity B)·(width (W41) of signal line(s) 41)/(thickness (T10) of first insulating layer (insulating layer B) 10)>(relative permittivity A)·{(thickness (T41) of signal line(s) 41)/(distance (S1) between signal line(s) 41 and one conductive line 42a)+(thickness (T41) of signal line(s) 41)/(distance (S2) between signal line(s) 41 and other conductive line 42b)+(thickness (T41) of signal lines 41)/(distance (S3) between pair of signal lines (41a and 41b)·2} is satisfied.
Public/Granted literature
- US20120205141A1 PRINTED WIRING BOARD Public/Granted day:2012-08-16
Information query