Invention Grant
- Patent Title: Cu pillar bump with non-metal sidewall protection structure
- Patent Title (中): 铜柱凸起与非金属侧壁保护结构
-
Application No.: US12730411Application Date: 2010-03-24
-
Publication No.: US08841766B2Publication Date: 2014-09-23
- Inventor: Chien Ling Hwang , Yi-Wen Wu , Chun-Chieh Wang , Chung-Shi Liu
- Applicant: Chien Ling Hwang , Yi-Wen Wu , Chun-Chieh Wang , Chung-Shi Liu
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L23/50
- IPC: H01L23/50 ; H01L23/00
Abstract:
Sidewall protection processes are provided for Cu pillar bump technology, in which a protection structure on the sidewalls of the Cu pillar bump is formed of at least one of non-metal material layers, for example a dielectric material layer, a polymer material layer, or combinations thereof.
Public/Granted literature
- US20110233761A1 CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE Public/Granted day:2011-09-29
Information query
IPC分类:
