Invention Grant
US08841750B2 Local wiring for a bipolar junction transistor including a self-aligned emitter region
有权
包括自对准发射极区域的双极结型晶体管的局部布线
- Patent Title: Local wiring for a bipolar junction transistor including a self-aligned emitter region
- Patent Title (中): 包括自对准发射极区域的双极结型晶体管的局部布线
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Application No.: US13551971Application Date: 2012-07-18
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Publication No.: US08841750B2Publication Date: 2014-09-23
- Inventor: David L. Harame , Zhong-Xiang He , Qizhi Liu
- Applicant: David L. Harame , Zhong-Xiang He , Qizhi Liu
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Michael J. LeStrange
- Main IPC: H01L29/732
- IPC: H01L29/732 ; H01L29/66 ; H01L29/73 ; H01L29/08

Abstract:
Aspects of the invention provide for a bipolar transistor of a self-aligned emitter. In one embodiment, the invention provides a method of forming local wiring for a bipolar transistor with a self-aligned sacrificial emitter, including: performing an etch to remove the sacrificial emitter to form an emitter opening between two nitride spacers; depositing an in-situ doped emitter into the emitter opening; performing a recess etch to partially remove a portion of the in-situ doped emitter; depositing a silicon dioxide layer over the recessed in-situ doped emitter; planarizing the silicon dioxide layer via chemical mechanical polishing; etching an emitter trench over the recessed in-situ doped emitter; and depositing tungsten and forming a tungsten wiring within the emitter trench via chemical mechanical polishing.
Public/Granted literature
- US20140021587A1 LOCAL WIRING FOR A BIPOLAR JUNCTION TRANSISTOR INCLUDING A SELF-ALIGNED EMITTER REGION Public/Granted day:2014-01-23
Information query
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