Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US13968454Application Date: 2013-08-16
-
Publication No.: US08841729B2Publication Date: 2014-09-23
- Inventor: Junichi Kamoshita
- Applicant: Lapis Semiconductor Co., Ltd.
- Applicant Address: JP Yokohama
- Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee Address: JP Yokohama
- Agency: Volentine & Whitt, PLLC
- Priority: JP2012-188888 20120829
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/66 ; H01L21/8234 ; H01L27/02 ; H01L29/78

Abstract:
Provided is a semiconductor device including active regions formed in a semiconductor substrate and arranged in a first direction parallel to a surface of the semiconductor substrate; a first element isolating region formed in the semiconductor substrate and electrically isolating adjacent active regions from each other; and gate electrodes extending over the active regions respectively and arranged in the first direction. The first element isolating region includes a first region extending in a second direction orthogonal to the first direction and a second region extending in a direction intersecting the first region, one gate electrode of adjacent gate electrodes has a first edge side which includes a first overlap part placed on the second region, and another gate electrode of the adjacent gate electrodes has a second edge side which faces the first edge side and includes a second overlap part placed on the second region.
Public/Granted literature
- US20140061804A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-03-06
Information query
IPC分类: