Invention Grant
- Patent Title: Semiconductor substrate and semiconductor chip
- Patent Title (中): 半导体衬底和半导体芯片
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Application No.: US13803613Application Date: 2013-03-14
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Publication No.: US08841720B2Publication Date: 2014-09-23
- Inventor: Takayuki Hashimoto
- Applicant: Takayuki Hashimoto
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, PC
- Priority: JP2010-62141 20100318
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L25/07 ; H01L23/495 ; H01L25/16 ; H01L23/00

Abstract:
A semiconductor substrate capable of detecting operating current of a MOSFET and diode current in a miniaturized MOSFET such as a trench-gate type MOSFET is provided. A semiconductor substrate includes a main current region and a current sensing region in which current smaller than main current flowing in the main current region flows. The main current region has a source electrode disposed on a main surface, the source electrode being in contact with a p-type semiconductor region (body) and an n+-type semiconductor region (source), and the current sensing region has a MOSFET current detecting electrode and a diode current detecting electrode on a main surface, the MOSFET current detecting electrode being in contact with the p-type semiconductor region (body) and the n+-type semiconductor region (source), the diode current detecting electrode being in contact with the p-type semiconductor region (body).
Public/Granted literature
- US20130193479A1 SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR CHIP Public/Granted day:2013-08-01
Information query
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