Invention Grant
- Patent Title: Method of global design closure at top level and driving of downstream implementation flow
- Patent Title (中): 顶级全球设计关闭方法和下游实施流程驱动
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Application No.: US14055653Application Date: 2013-10-16
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Publication No.: US08839171B1Publication Date: 2014-09-16
- Inventor: Ravi Varadarajan , Jitendra Gupta , Sanjiv Mathur , Priyank Mittal , Kaushal Kishore Pathak , Kshitiz Krishna , Anup Nagrath , Ritesh Mittal
- Applicant: Atrenta, Inc.
- Applicant Address: US CA San Jose
- Assignee: Atrenta, Inc.
- Current Assignee: Atrenta, Inc.
- Current Assignee Address: US CA San Jose
- Agent Thomas Schneck; Mark Protsik
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
System-on-chip (SoC) designs include large amounts of interconnected intellectual property blocks and standard-cell logic using complex bus fabrics. Today SoC design-closure that validates design targets of area, timing, congestion and power constraints is accomplished post routing as over 80% of validation problems are due to global-interconnect. A method is disclosed that allows the designers to achieve global design-closure and physical topology constraints, early in the design cycle, at much higher levels of abstraction. In particular, logic hierarchy of the design is converted into a physical hierarchy of functional-related clusters of locally-connected logic. The clusters and inter-cluster global connections can be refined to meet design constraints in order to generate a top-level floor-plan in the form of library and constraint files. Using the results of this top-down global design-closure method the designers can use the generated floor-plan to guide downstream tools to achieve predictable and correlatable design implementation.
Public/Granted literature
- US20140298281A1 METHOD OF GLOBAL DESIGN CLOSURE AT TOP LEVEL AND DRIVING OF DOWNSTREAM IMPLEMENTATION FLOW Public/Granted day:2014-10-02
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