Invention Grant
- Patent Title: Wafer detecting apparatus
- Patent Title (中): 晶圆检测装置
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Application No.: US13468353Application Date: 2012-05-10
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Publication No.: US08837777B2Publication Date: 2014-09-16
- Inventor: Katsumi Yasuda , Toshio Kamigaki , Takumi Mizokawa
- Applicant: Katsumi Yasuda , Toshio Kamigaki , Takumi Mizokawa
- Applicant Address: JP Tokyo
- Assignee: Sinfonia Technology Co., Ltd.
- Current Assignee: Sinfonia Technology Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-262020 20091117
- Main IPC: G06K9/00
- IPC: G06K9/00 ; H01L21/67

Abstract:
A wafer detecting apparatus detects storage states of a plurality of wafers stored in a wafer container. The plurality of wafers are stored substantially horizontal in slots in the wafer container to be transferred in and out of a front opening of the wafer container. The wafer detecting apparatus includes a vertically extending illumination device that emits light through the front opening onto the plurality of wafers and an imaging device that receives the light reflected from the plurality of wafers. The imaging device is arranged substantially directly in front of the wafer container and the illumination device is arranged in at least one of left and right sides of the imaging device.
Public/Granted literature
- US20120281875A1 WAFER DETECTING APPARATUS Public/Granted day:2012-11-08
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