Invention Grant
- Patent Title: Circuit board socket with support structure
- Patent Title (中): 电路板插座带支撑结构
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Application No.: US12774780Application Date: 2010-05-06
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Publication No.: US08837162B2Publication Date: 2014-09-16
- Inventor: Stephen Heng , Mahesh S. Hardikar
- Applicant: Stephen Heng , Mahesh S. Hardikar
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K7/10 ; H05K1/18 ; H05K3/36
Abstract:
Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion of the circuit board. The support structure includes a plurality of nested frames.
Public/Granted literature
- US20110273858A1 CIRCUIT BOARD SOCKET WITH SUPPORT STRUCTURE Public/Granted day:2011-11-10
Information query
