Invention Grant
US08837138B2 Removable airflow guide assembly with a processor air cooler and memory bank coolers
有权
具有处理器空气冷却器和存储器组冷却器的可移动导流组件
- Patent Title: Removable airflow guide assembly with a processor air cooler and memory bank coolers
- Patent Title (中): 具有处理器空气冷却器和存储器组冷却器的可移动导流组件
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Application No.: US13406335Application Date: 2012-02-27
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Publication No.: US08837138B2Publication Date: 2014-09-16
- Inventor: Andrew L. Wiltzius , Tom J Searby , Robert Lee Crane , Adolfo Adolfo Gomez
- Applicant: Andrew L. Wiltzius , Tom J Searby , Robert Lee Crane , Adolfo Adolfo Gomez
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Caroline Pinkston
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K5/00 ; H05K7/20 ; H02B1/01
Abstract:
Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.
Public/Granted literature
- US20130222999A1 REMOVABLE AIRFLOW GUIDE ASSEMBLY WITH A PROCESSOR AIR COOLER AND MEMORY BANK COOLERS Public/Granted day:2013-08-29
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