Invention Grant
- Patent Title: Integrated circuit apparatus, systems, and methods
- Patent Title (中): 集成电路设备，系统和方法
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Application No.: US13953427Application Date: 2013-07-29
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Publication No.: US08832631B2Publication Date: 2014-09-09
- Inventor: Paul A. Silvestri
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L21/50 ; H01L23/48 ; H01L23/00 ; H01L25/065 ; H01L25/18 ; H01L23/50
Abstract:
High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.
Public/Granted literature
- US20130307164A1 INTEGRATED CIRCUIT APPARATUS, SYSTEMS, AND METHODS Public/Granted day:2013-11-21
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