An apparatus comprising a first substrate, a second substrate, and one or more embedded devices. A lower surface of the first substrate generally has disposed thereon a plurality of first lines comprising a thin-film conductive material. An upper surface of the second substrate generally has disposed thereon a plurality of second lines comprising the thin-film conductive material. The plurality of second lines is generally arranged orthogonally to the plurality of first lines. The lower surface of first substrate generally faces the upper surface of the second substrate and the substrates are generally separated by a predefined distance. The one or more embedded devices are generally coupled between one or more of the first lines and one or more of the second lines. The embedded devices are generally configured to temporarily electrically connect the respective lines to form a radiating structure during an RF operation.