Invention Grant
- Patent Title: Wireless communications circuitry with temperature compensation
- Patent Title (中): 带温度补偿的无线通信电路
-
Application No.: US13460718Application Date: 2012-04-30
-
Publication No.: US08831529B2Publication Date: 2014-09-09
- Inventor: Yuping Toh , Anh Luong
- Applicant: Yuping Toh , Anh Luong
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group
- Agent Jason Tsai
- Main IPC: H04B17/00
- IPC: H04B17/00 ; G01R31/00

Abstract:
A test system for calibrating wireless electronic devices is provided. The test system may include a test host, a radio communication tester, and a temperature chamber in which an electronic device under test (DUT) may be tested. The DUT may include a temperature sensor for monitoring an internal temperature of the DUT and may include power amplifier circuitry for outputting radio-frequency test signals. The tester may be used to measure output power levels of the radio-frequency test signals when the DUT is operating at a given reference temperature and when the DUT is operating at target operating temperature levels other than the given reference temperature. Power amplifier output level offset compensation values may be computed by comparing output power levels measured at each of the target operating temperatures to output power levels measured at the given reference temperature and may be stored in the DUT prior to normal operation.
Public/Granted literature
- US20130288610A1 Wireless Communications Circuitry with Temperature Compensation Public/Granted day:2013-10-31
Information query