Invention Grant
- Patent Title: Circuit device
- Patent Title (中): 电路设备
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Application No.: US13306302Application Date: 2011-11-29
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Publication No.: US08830694B2Publication Date: 2014-09-09
- Inventor: Masaya Kawano , Yasutaka Nakashiba
- Applicant: Masaya Kawano , Yasutaka Nakashiba
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2008-174111 20080703
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K7/00 ; H05K1/11 ; H01F5/00 ; H01F17/00 ; H01F38/14
Abstract:
The device includes a first inductor, a first insulating layer, a second inductor, and a third inductor. The first inductor includes a helical conductive pattern. The second inductor is located in a region overlapping the first inductor through the first insulating layer. The second inductor includes a helical conductive pattern. The third inductor is connected in series to the second inductor, and includes a helical conductive pattern.
Public/Granted literature
- US20120075050A1 CIRCUIT DEVICE Public/Granted day:2012-03-29
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