Invention Grant
US08830692B2 Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component 有权
球栅阵列系统,用于使用Z定向印刷电路板部件表面安装集成电路

  • Patent Title: Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component
  • Patent Title (中): 球栅阵列系统,用于使用Z定向印刷电路板部件表面安装集成电路
  • Application No.: US13433364
    Application Date: 2012-03-29
  • Publication No.: US08830692B2
    Publication Date: 2014-09-09
  • Inventor: Keith Bryan Hardin
  • Applicant: Keith Bryan Hardin
  • Applicant Address: US KY Lexington
  • Assignee: Lexmark International, Inc.
  • Current Assignee: Lexmark International, Inc.
  • Current Assignee Address: US KY Lexington
  • Agent Justin M Tromp
  • Main IPC: H01R9/00
  • IPC: H01R9/00
Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component
Abstract:
A printed circuit board according to one example embodiment includes a Z-directed component mounted in a mounting hole in the printed circuit board. The Z-directed component includes a body having a top surface, a bottom surface and a side surface. Four conductive channels extend through a portion of the body along the length of the body. The four conductive channels are spaced substantially equally around a perimeter of the body. An integrated circuit is mounted on a surface of the printed circuit board. The integrated circuit has a ball grid array that includes four conductive balls electrically connected to a corresponding one of the four conductive channels of the Z-directed component.
Information query
Patent Agency Ranking
0/0